1622139 Mode
Espesifikasyon pou 1622139
Nimewo pati : 1622139
Fabricant : Phoenix Contact
Deskripsyon : CONN DUST COVER M23 SILVER
Seri : SH
Estati Pati : Active
Kalite akseswa : Cap (Cover), Dust
Pou itilize ak pwodwi ki gen rapò : M23 Hybrid and Power Connectors
Kalite Shell - Antre : M23
Materyèl : Metal
Karakteristik : Dust Tight, Metal Chain with Ring, Waterproof
Koulè : Silver
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-1622139
Fabricant
Kout Deskripsyon
CONN DUST COVER M23 SILVER
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
32578 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 1622139 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 1622139 Phoenix Contact
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 208QFP | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 128MC 7.5NS 128TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 208QFP | ||
| Intel | IC CPLD 512MC 7.5NS 256FBGA | ||
| Intel | IC CPLD 256MC 5.5NS 100TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 324BGA |